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subject low resistance value chip resistor spec. no. 151-rjm-e2w00a part no. ERJM1W 10 - panasonic electronic devices co.,ltd. 1 1.dimension ERJM1Wt type ERJM1Ws type 1) protective coating 2) re sistive element 3) terminal 4) outer terminal resin alloy metal metal metal plating (sn) l w t a ERJM1Wt 6.40+/-0.40 [.252+/-.016] 2.10+/-0.30 [.083+/-.012] ERJM1Ws 6.40+/-0.25 [.252+/-.010] 3.20+/-0.25 [.126+/-.010] 0.80+/-0.30 [.031+/-.012] 1.00+/-0.25 [.039+/-.010] unit: mm, [inches] 2.power derating curve 3) w t l 4) 2) a 1) w a 3) t 4) 2) 1) l category temperature range (operating temperature range): -55 to +170 deg.c fig.1 200 -40 120 0 80 40 160 -55 20 120 60 80 40 0 100 70 170 rated load (%) ambient temperature (deg.c)
subject low resistance value chip resistor spec. no. 151-rjm-e2w00a part no. ERJM1W 10 - panasonic electronic devices co.,ltd. 2 3.ratings item specifications explanation power rating 2.0w (70deg.c) when you use one at ambi ent temperature over 70deg.c, the load power shall be reduced as shown in fig.1. rated continuous working voltage (rcwv) the rated voltage at each resistanc e shall be calculated from the equation below, e p r e: rcwv(v), p: rated powe r(w), r: resistance value( ? ) resistance tolerance f:+/-1%, j:+/-5% resistance range (standard resistance value) ERJM1Wt type : 4m ? (4m ? ) ERJM1Ws type : 5m to 10m ? (5, 6, 7,10m ? ) 4. explanation of part number chip resistor structure rated power type tolerance resistance value packaging 5. appearance and construction item specifications and explanation appearance and construction 1. the surface of resistor is covered with protective coating and hard to fade, then don't have unevenness, flaw pinhole and discoloration. 2. the surface of terminal is covered by the plating. and the plating is hard to fade, then don't have unevenness, flaw, pinhole and discoloration. 3. the terminal is connected with resistive plate certainly. u m 0 5 f s w 1 m j r e u embossed taping f +/- 1% j +/- 5% 3m0 3m ? 10m 10m ? (ex.) t wide terminal s standard terminal
subject low resistance value chip resistor spec. no. 151-rjm-e2w00a part no. ERJM1W 10 - panasonic electronic devices co.,ltd. 3 as far as there shall not designation especially, the fo llowing test and measurement shall be operated under normal temperatur e(15 to 35deg.c), normal humidity(25 to 75%), normal atmospheric pressure(8.6 10 4 to 1.06 10 5 pa). resistance value shall be guaranteed as like followings. 6.electrical performance characteristics item specifications test methods(based on jis - c5201) dc resistance dc resistance value must be within the specified tolerance. measuring current: 1a 20deg.c 65%rh ERJM1Wt type 4m ? +/-75 10 -6 /deg.c ERJM1Ws type temperature coefficient 5m ? +/-75 10 -6 /deg.c sequence of temperature: +25deg.c to +125deg.c intermittent overload ? r = +/-(5%+0.5m ? ) resistance change after 1,000 cycles (1 second on, 25 seconds off) at 5 w rated power. dielectric withstanding no evidence of flash over, mechanical damage, arcing or insulation breakdown. insulation resistance min.1g ? ac500v 1 minute insulation resistance meter or ac power supply measuring voltage :dc500v wire top terminal
subject low resistance value chip resistor spec. no. 151-rjm-e2w00a part no. ERJM1W 10 - panasonic electronic devices co.,ltd. 4 7.mechanical performance characteristics item specifications test methods(based on jis-c5201) terminal strength min. 4.9n copper plate: t = 0.4mm pull speed :10mm/seconds bending strength without distinct deformation in appearance substrate : glass epoxy (t=1.6mm) span : 90mm bending distance : 2mm (10 seconds) solderability min. 95% coverage resistors shall be dipped in the melted solder bath at 230+/-5deg.c for 3+/-0.5 seconds. next, flux shall be removed from the surface of terminal with clean organic solvent. resistance to soldering heat ? r = +/-(5%+0.5m ? ) resistors shall be dipped in the melted solder bath at 270+/-3deg.c for 10+/-1 seconds. fixed solder p unit: mm a b c ERJM1Wt 3.1 2.2 ERJM1Ws 2.1 4.2 3.4 a test boa r d 40mm 100mm a b c
subject low resistance value chip resistor spec. no. 151-rjm-e2w00a part no. ERJM1W 10 - panasonic electronic devices co.,ltd. 5 8.enviromental characteristics item specifications test methods(based on jis-c5201) high temperature exposure ? r = +/-(1%+0.5m ? ) resistors shall be exposed at 125+/-3deg.c for 1000+48/-0 hours. temperature cycling ? r = +/-(1%+0.5m ? ) -55+/-3deg.c 30minutes normal temp. 30minutes 5 cycles +125+/-3deg.c 30minutes humidity (steady state) ? r = +/-(1%+0.5m ? ) resistors shall be exposed at 60+/-2deg.c and 90 to 95% relative humidity in a humidity test chamber for 1000+48/-0 hours. load life ? r = +/-(3%+0.5m ? ) resistors shall be exposed at 70+/-2deg.c for 1000 +48/-0 hours. during this time the rated voltage shall be applied intermittently for 1.5 hours on,0.5 hours off. load life in humidity ? r = +/-(3%+0.5m ? ) resistors shall be exposed at 60+/-2deg.c and 90 to 95% relative humidity for 1000+48/-0 hours. during this time the rated voltage shall be applied intermittently for 1.5 hours on,0.5 hours off. used printed circuit board (unit:mm) material:fr-4 (test board t=1.6mm) capper thickness:70 micro meter 9.resistance value marking express resistance value on resin side. example ERJM1Wt type 4m ? :r004 ERJM1Ws type 5m ? :5m0 , 6m ? :6m0 ,10m ? :10m t type2.2, s type4.2 48 28 35 68
subject low resistance value chip resistor spec. no. 151-rjm-e2w00a part no. ERJM1W 10 - panasonic electronic devices co.,ltd. 6 10.recommended pad layout 11.manufacturing country indonesia 3.4mm 2.2mm 3.1mm ERJM1Wt type ERJM1Ws type 3.4mm 4.2mm 2.1mm circuit patte r n (cu etc.) pad resist
subject low resistance value chip resistor spec. no. 151-rjm-e2w00a part no. ERJM1W 10 - panasonic electronic devices co.,ltd. 7 12. precautions in handling resistors ! precautions in handling resistors (1) this specification shows the quality and performance of a uni t component. before adoption, be sure to evaluate and verify the product mounting it in your product. (2) we take no responsibility for troubles caused by the product usage that is not specified in this specification. (3) in traffic transportation equipment(trains, cars, traffic signal equipment, etc.), medical equipment, aerospace equipment, electric heating appliances, combustion and gas equipment, rotating equipment, disaster and crime preventive equipment, etc. in cases where it is forecast that the failure of this product gives serious damage to the human life and others, use fail-safe design and ensure safe ty by studying the following items to ? ensure safety as the system by setting pr otective circuits and protective equipment. ? ensure safety as the system by setting su ch redundant circuits as do not cause danger by a single failure. (4) when a doubt shall be occurred about safety for this product, be sure to inform us rapidly, operate your techni cal examination. (5) the products in this specification are in tended for use in general standard applications for general electronic equipment(av products, househol d electric appliances, office equipment, information and communication equipment, etc.); hence, they do not ta ke the use under the following special environments into consideration. accordingl y, the use in the following special environments, and such environmental conditions may a ffect the performance of the products; prior to use, verify the per formance, reliabilit y, etc. thoroughly 1) use in liquids such as water, oil, chemical, and organic solvent 2) use under direct sunlight and in outdoor and dusty atmospheres 3) use in places full of corrosi ve gases such as sea breeze, cl 2 , h 2 s, nh 3 , so 2 , and no x . 4) use in environment with large static electricity and strong electromagnetic waves. 5) where the product is close to a heating component, and where an inflammable such as a polyvinyl chloride wire is arranged close to the product. 6) where the resistor is seal ed and coated with resin, etc. 7) where water or a water-soluble detergent is used in cleaning free soldering and in flux cleaning after soldering. (pay particula r attention to a water-soluble flux.) (6) if transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and confirmation test with resistor s actually mounted on y our own board. when the load more than rated power is applied under the load condition at st eady state, it may impair performance and/or reliability of re sistor. never exceed the rated power. (7) the resistor temperature is dependent on t he circuit board and pattern to be used, the heat from the neighboring components and ambient temperatures. the resistor temperature may rise up to 170deg.c (upper limit of category temperature range (operating temperature range)) or higher even if you k eep the rated power. prior to use, be sure to evaluate the product mounted on your own boar d, and then use it under the condition not to damage the board and the neighboring components. when the product shall be used under special condition, be sure to ask us in advance. (8) halogen type (chlorine type, bromine type, etc. ) or other high-activity flux is not recommended as the residue may affect performanc e or reliability of resistors. (9) when soldering with soldering iron, never touch the body of the chip resi stor with a tip of the soldering iron. when using a soldering iron with a tip at high temperature, solder for a time as short as possible. (3 seconds or less up to 350deg.c) (10)avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may damage prot ective film or the body of resi stor and may affect resistor's performance. (11)keep the rated power and am bient temperature within t he specified derating curve. (12)avoid immersion of chip resistor in solvent for a long time. prior to use, verify the performance.
subject low resistance value chip resistor spec. no. 151-rjm-e2w00a part no. ERJM1W 10 - panasonic electronic devices co.,ltd. 8 13.storage method if the product is stored in the fo llowing environments and conditions, the performance and solderability may be badly affected, avoid the storage in the following environments. 1) storage in places full of corrosi ve gases such as sea breeze, cl 2 , h 2 s, nh 3 , so 2 and no x . 2) storage in places expos ed to direct sunlight. 3) storage in places outside the tem perature range of 5 to 35deg.c and humidity range of 45 to 85%rh. 4) storage over one year after our delivery (t his item also applies to the case that the storage method specified in item 1) - 3) have been followed.) 14. law, regulation 1) this product has not been manufactur ed with any ozone depl eting chemical controlled under the m ontreal protocol. 2) this product complies with the rohs dire ctive (restriction of the use of certain hazardous. substances in elec trical and electronic equipment (directive 2002/95/ec)). 3) all the materials used in this par t are registered material under the law concerning the examinat ion and regulation of manuf actures, etc. of chemical substances. 4 all the materials used in this part c ontain no brominated materials of pbbos or pbbs as the flame-retardant. 5) if you need the notice by letter of "a preliminary judgement on the laws of japan foreign exchange and foreign trade control", be sure to let us know.
subject low resistance value chip resistor spec. no. 151-rjm-e2w00a part no. ERJM1W 10 - panasonic electronic devices co.,ltd. 9 15. recommendable reflow soldering profile recommendable reflow soldering ? please measure temperature of terminals and study solderability every type of boards, before actual use. ? please inquire of us when y ou use the different conditions. ? reflow soldering shall be within two times. recommendable flow soldering condition time preheating 100 c to 160 c 60 s to 120 s soldering 270 c max. 10 s max. replacement with soldering iron note the followings in case of us ing soldering iron for replacement. (1) the tip temperature should be less than 350 c for the period within 3 s for each terminal. (2) the soldering iron tip should not touch the product directly. time preheatin main heating peak temperature condition time preheating 150 o c to 180 o c 60 s to 120 s main heating 230 o c min. 30 s to 40 s peak 260 o c max. 10 s max.
subject low resistance value chip resistor spec. no. 151-rjm-e2w00a part no. ERJM1W 10 - panasonic electronic devices co.,ltd. 10 taping 1. application range this specification covers t aping spec. of ERJM1W type. 2. physical dimensions 2-1 structure and reel dimensions s hall be as shown in the figure below. unit : mm 2-2 carrier tape dimensions a b w f e p1 3.60+/-0.20 [.141+/-.008] 6.90+/-0.20 [.272+/-.008] 12.0+/-0.30 [.472+/-.012] 5.50+/-0.05 [.217+/-.002] 1.75+/-0.10 [.069+/-.004] 4.00+/-0.10 [.157+/-.004] p2 p0 d0 d1 t t2 2.00+/-0.05 [.079+/-.002] 4.00+/-0.10 [.157+/-.004] 1.50+0.10/-0 [.059+0.04/-0] min. 1.50 [min. .059] max. 0.40 [max. .016] 1.60+/-0.10 [.063+/-.004] unit: mm, [inches] adhesive tape top tape carrier tape (embossed) d1 chip resistor p2 p0 min. 60.0 15.4 +/- 2.0 13.0 +/- 1.0 180.0 +0 / -3.0 13.0 +/- 1.0 min. 60.0
subject low resistance value chip resistor spec. no. 151-rjm-e2w00a part no. ERJM1W 10 - panasonic electronic devices co.,ltd. 11 3. specifications 3-1 specifications of taping ? when the test shall be operated with the below conditions, the peel strength shall be 0.098n to 0.686n and the t ape shall not have flash and tear after peeling. ? minimum bending radius when the carrier tape shall be bent to minimum bending radius (15mm), there shall be no defection of chip and no break of the carrier tape. however the test shall be done for 1 time. ? resistance to climate when resistors shall be exposed at 60deg. c, 90 to 95 %rh for 120 hours, there shall be no defection of chip and no break of carrier tape. when the top tape shall be peeled, it shall not have flash and tear. 3-2 quantity in reel : 3000 pcs./reel 3-3 taping condition ? chip resistors shall not be st icking to top tape and bottom tape. ? chip resistors shall be easy to take out from carrier tape. ? compartment and sprocket hole shall not have flash and break. 4. outer packaging ? when reels shall not reach max. quantit y, the remaining em pty space shall be buried with buffer material. ? when the quantity shall be few, alternat ive packaging methods may be used. no problem must occur during t he exportation of the product. 5. marking ? side of reel(marking shall be on one side.) 1) part name('fixed metal plate flat ch ip resistor' following part name on invoice) 2) part number 3) quantity 4) lot number 5) maker name 6) manufacturing country ? packaging box 1) part number 2) quantity 3) maker name tape marking 10 peeling direction top tape carrier ta p e

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